Title:
RESIN FILM MATERIAL, LAMINATED STRUCTURE COMPRISING RESIN FILM MATERIAL, RESIN COMPOSITION MANUFACTURING METHOD, RESIN FILM MATERIAL MANUFACTURING METHOD, AND LAMINATED STRUCTURE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/124146
Kind Code:
A1
Abstract:
Provided is a resin film material in which a resin material including laminates which comprise a resin layer having a metal vapor-deposited layer is used as a raw material, and which contains the metal as particles. The metal particles are dispersed in the film material, and no more than 1 metal particle having an equivalent area diameter of no less than 200 µm exists in each 1 cm2 of the resin film material. It is suitable to use, as the raw material, a resin material formed from a laminate group including a laminate comprising a resin layer which has the metal vapor-deposited layer, and a laminate comprising a resin layer which does not have a metal layer.
Inventors:
FUKUI SHUNSUKE (JP)
KATAYANAGI GOTA (JP)
SATO KEITO (JP)
AOKI KATSUTOSHI (JP)
KATAYANAGI GOTA (JP)
SATO KEITO (JP)
AOKI KATSUTOSHI (JP)
Application Number:
PCT/JP2021/043954
Publication Date:
June 16, 2022
Filing Date:
November 30, 2021
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
B32B27/00; B29B17/02; B32B15/08; B32B27/20; C08K3/08; C08L23/02; C08L67/00; C08L77/00; C08L79/08; C08L101/00
Domestic Patent References:
| WO2020166522A1 | 2020-08-20 |
Foreign References:
| JP2010167736A | 2010-08-05 | |||
| JP2013035272A | 2013-02-21 | |||
| JP2020049942A | 2020-04-02 | |||
| JP2002309005A | 2002-10-23 | |||
| JP2006192748A | 2006-07-27 | |||
| JP2012021200A | 2012-02-02 | |||
| JP2013035272A | 2013-02-21 | |||
| US20190062921A1 | 2019-02-28 |
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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