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Patent Searching and Data


Title:
RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2017/006510
Kind Code:
A1
Abstract:
This resin film (2) is provided with a plurality of through holes (21) that penetrate therethrough in the thickness direction. Each through hole (21) has a columnar shape. The average density of the through holes (21) is from 1 × 106 to 1 × 1012 through holes/cm2. The average diameter of the through holes (21) is 1-310 nm. The variability rate of the diameters of the through holes (21) as obtained by multiplying a value, which is obtained by dividing the standard deviation of the diameters of the through holes (21) by the average diameter of the through holes (21), by 100 is 30% or less.

Inventors:
YAMAMOTO HAJIME (JP)
MIYAZAKI TSUKASA (JP)
TAKEDA YUUKI (JP)
FURUYAMA SATORU (JP)
Application Number:
PCT/JP2016/002630
Publication Date:
January 12, 2017
Filing Date:
June 01, 2016
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
B29C67/20; B01D69/00; B01D69/06; B01D71/48; B01D71/64; B23K15/00; B23K15/08; C08J9/00
Domestic Patent References:
WO2013035747A12013-03-14
Foreign References:
JP2012195928A2012-10-11
Other References:
See also references of EP 3321075A4
Attorney, Agent or Firm:
KAMADA, Koichi (JP)
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