Title:
RESIN LAMINATE FOR PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/085011
Kind Code:
A1
Abstract:
[Problem] To provide a resin laminate for a packaging material having improved workability, the resin laminate being characterized in that a base material layer and a sealant layer are formed from the same resource. [Solution] A resin laminate comprising at least a base material layer and a sealant layer, characterized in that the main component of resin compositions constituting the base material layer and the sealant layer is configured from the same resin composition, and the fusion initiation temperature of the base material layer (FIT-B) and the seal strength reached temperature of the sealant layer (SRT-S) satisfy formulas (1) to (3). Formula (1): 50°C≤(FIT-B)–(SRT-S)≤90 (°C); Formula (2): 90≤(SRT-S)≤120 (°C); Formula (3): 160≤(FIT-B)≤180 (°C)
Inventors:
IMAI TORU (JP)
TANEKI KENSUKE (JP)
HAMANO AKITO (JP)
TAGA ATSUSHI (JP)
TANEKI KENSUKE (JP)
HAMANO AKITO (JP)
TAGA ATSUSHI (JP)
Application Number:
PCT/JP2022/038788
Publication Date:
May 19, 2023
Filing Date:
October 18, 2022
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B7/027; B32B7/022; B32B7/028; B32B7/12; B32B27/00; B32B27/32; B65D65/40
Domestic Patent References:
| WO2019244708A1 | 2019-12-26 | |||
| WO2007015415A1 | 2007-02-08 | |||
| WO2020262326A1 | 2020-12-30 | |||
| WO2021054349A1 | 2021-03-25 | |||
| WO2020080507A1 | 2020-04-23 |
Foreign References:
| JP2020192896A | 2020-12-03 | |||
| JP2021169194A | 2021-10-28 | |||
| JP2018167867A | 2018-11-01 | |||
| JP2005178337A | 2005-07-07 | |||
| JP2020157715A | 2020-10-01 |
Other References:
ZAMBELLI, MACROMOLECULES, vol. 6, 1973, pages 925
Download PDF:
Previous Patent: LIGHT-EMITTING DEVICE AND IMAGE DISPLAY DEVICE
Next Patent: METHOD FOR PRODUCING COMPOSITE OPTICAL CERAMIC ELEMENT
Next Patent: METHOD FOR PRODUCING COMPOSITE OPTICAL CERAMIC ELEMENT