RESIN MATERIAL FOR JOINING, METHOD FOR MANUFACTURING SAME, AND JOINING METHOD USING RESIN MATERIAL FOR JOINING

WIPO Patent Application WO/2023/153332

A1

Provided are: a resin material for joining that can be suitably used to join resin materials together or a resin material and a metal material without using rivet fastening or other mechanical joining; a method for manufacturing the resin material for joining simply and efficiently; and a joining method using the resin material for joining. Further provided are: a resin material for joining that can be applied to both thermoplastic resins and thermosetting resins and that can improve the joining strength and the joint reliability of both direct joining of materials to be joined and joining using an adhesive; a method for manufacturing the resin material for joining simply and efficiently; and a joining method using the resin material for joining. This resin material for joining is characterized in that at least part of a surface of the resin material comprises an unsaturated graphitized region that has C=C bonds and/or C–C bonds. It is preferable for the graphitized region to be amorphous carbon.

HAMADA NAGISA (JP)
WASHIKA KIMINORI (JP)
ISHIKAWA NAOMOTO (JP)
MIYAMOTO NOBUKI (JP)
YAMAGUCHI MAKOTO (JP)

PCT/JP2023/003621

August 17, 2023

February 03, 2023

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HIROTEC CORP (JP)
KIGUCHI TECHNICS INC (JP)
UNIV AKITA (JP)

C09J5/02; B29C65/48; C08J7/00

WO2021230025A1

2021-11-18

JPS62501427A	1987-06-11
JP2019123153A	2019-07-25
JP2001345469A	2001-12-14
JP2021120196A	2021-08-19
JP2018080360A	2018-05-24

IPR CONSULTANT PPC (JP)

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