Title:
RESIN MATERIAL AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/139639
Kind Code:
A1
Abstract:
A resin material is provided which can effectively improve insulation properties and thermal conductivity, can effectively suppress variation in dielectric breakdown strength and can further effectively increase adhesion. This resin material contains first inorganic particles, second inorganic particles and a binder resin. The aspect ratio of the primary particles constituting the first inorganic particles is greater than or equal to 7, and the aspect ratio of the primary particles constituting the second inorganic particles is less than 7. Both the compressive strength at 10% compression of the first inorganic particles and the compressive strength at 10% compression of the second inorganic particles are less than or equal to 2 N/mm2.
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Inventors:
KAWAHARA YUKO (JP)
OOWASHI KEIGO (JP)
ASHIBA KOUJI (JP)
SUGIMOTO MASATAKA (JP)
OOWASHI KEIGO (JP)
ASHIBA KOUJI (JP)
SUGIMOTO MASATAKA (JP)
Application Number:
PCT/JP2018/002716
Publication Date:
August 02, 2018
Filing Date:
January 29, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; B32B27/18; C01B21/064; C08K3/38; C08K7/00; H01L23/373
Domestic Patent References:
| WO2014199650A1 | 2014-12-18 | |||
| WO2018008450A1 | 2018-01-11 |
Foreign References:
| JP2014208818A | 2014-11-06 | |||
| JP2011006586A | 2011-01-13 | |||
| JP2017082163A | 2017-05-18 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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