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Patent Searching and Data


Title:
RESIN MATERIAL AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/139640
Kind Code:
A1
Abstract:
A resin material is provided which can effectively improve insulation properties and thermal conductivity, can further effectively suppress variation in dielectric breakdown strength and can further effectively increase adhesion. This resin material contains first inorganic particles, second inorganic particles and a binder resin. The ratio of the compressive strength at 10% compression of the first inorganic particles to the compressive strength at 10% compression of the second inorganic particles is greater than or equal to 2.5. The compressive strength at 10% compression of the second inorganic particles is less than or equal to 1.5 N/mm2, and the aspect ratio of the primary particles constituting the second inorganic particles is less than or equal to 7.

Inventors:
KAWAHARA, Yuko (32, Wadai, Tsukuba-sh, Ibaraki 92, 〒3004292, JP)
OOWASHI, Keigo (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
ASHIBA, Kouji (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
SUGIMOTO, Masataka (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
Application Number:
JP2018/002717
Publication Date:
August 02, 2018
Filing Date:
January 29, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
International Classes:
C08L101/00; B32B27/18; C01B21/064; C08K3/38; C08K7/00; H01L23/373
Domestic Patent References:
WO2014199650A12014-12-18
Foreign References:
JP2015034269A2015-02-19
JP2015010200A2015-01-19
JP2017128475A2017-07-27
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-ku, Osaka-sh, Osaka 28, 〒5400028, JP)
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