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Patent Searching and Data


Title:
RESIN MATERIAL AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/139642
Kind Code:
A1
Abstract:
A resin material is provided which can effectively improve insulation properties, can effectively suppress variation in dielectric breakdown strength and can further effectively increase adhesion. This resin material contains first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin. The specific surface area is greater than or equal to 1.3 m²/g in pores in the first boron nitride aggregate particles that have a pore diameter greater than 0 µm and less than or equal to 5 µm, the specific surface area is less than 1.3 m²/g in pores in the second boron nitride aggregate particles that have a pore diameter greater than 0 µm and less than or equal to 5 µm, and the porosity of the second boron nitride aggregate particles is greater than or equal to 35%.

Inventors:
KAWAHARA, Yuko (32, Wadai, Tsukuba-sh, Ibaraki 92, 〒3004292, JP)
OOWASHI, Keigo (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
ASHIBA, Kouji (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
SUGIMOTO, Masataka (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
Application Number:
JP2018/002719
Publication Date:
August 02, 2018
Filing Date:
January 29, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
International Classes:
C08L101/00; B32B27/18; C01B21/064; C08K3/38; C09K5/14; H01L23/36
Domestic Patent References:
WO2014199650A12014-12-18
WO2018008450A12018-01-11
Foreign References:
JP2011006586A2011-01-13
JP2015006980A2015-01-15
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-ku, Osaka-sh, Osaka 28, 〒5400028, JP)
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