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Patent Searching and Data


Title:
RESIN MATERIAL AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/139643
Kind Code:
A1
Abstract:
Provided is a resin material with which it is possible to effectively improve insulating properties and thermal conductance, effectively curb variation in breakdown strength, and effectively improve adhesion. The resin material according to the present invention contains first boron nitride cohesive particles, second boron nitride cohesive particles, and a binder resin. The first boron nitride cohesive particles, when compressed from 10% to 40% of the particle diameter, generate cracking at least once as a result of compressive displacement of 5% or more of the particle diameter. The aspect ratio of primary particles that constitute the first boron nitride cohesive particles exceeds 7. The second boron nitride cohesive particles, when compressed from 5% to 75% of the particle diameter, generate cracking at least three times as a result of compression displacement of 2% or more of particle diameter. The aspect ratio of the primary particles that constitute the second boron nitride cohesive particles does not exceed 7.

Inventors:
KAWAHARA, Yuko (32, Wadai, Tsukuba-sh, Ibaraki 92, 〒3004292, JP)
OOWASHI, Keigo (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
ASHIBA, Kouji (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
SUGIMOTO, Masataka (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
Application Number:
JP2018/002720
Publication Date:
August 02, 2018
Filing Date:
January 29, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
International Classes:
C08L101/00; B32B27/18; C08K3/38; C01B21/064
Domestic Patent References:
WO2014199650A12014-12-18
WO2013145961A12013-10-03
Foreign References:
JP2011006586A2011-01-13
JP2015189884A2015-11-02
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-ku, Osaka-sh, Osaka 28, 〒5400028, JP)
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