Title:
RESIN MATERIAL AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2018/139645
Kind Code:
A1
Abstract:
A resin material is provided which can effectively improve insulation properties and long-term reliability, can effectively suppress variation in dielectric breakdown strength and can further effectively increase adhesion. This resin material contains first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin. The porosity of the first boron nitride aggregate particles is less than 30% and the porosity of the second boron nitride aggregate particles is greater than or equal to 30%. Both the aspect ratio of the primary particles constituting the first boron nitride aggregate particles and the aspect ratio of the primary particles constituting the second inorganic particles are less than 7.
Inventors:
KAWAHARA YUKO (JP)
OOWASHI KEIGO (JP)
ASHIBA KOUJI (JP)
SUGIMOTO MASATAKA (JP)
OOWASHI KEIGO (JP)
ASHIBA KOUJI (JP)
SUGIMOTO MASATAKA (JP)
Application Number:
PCT/JP2018/002722
Publication Date:
August 02, 2018
Filing Date:
January 29, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; B32B27/18; C01B21/064; C08K3/38; C09K5/14; H01L23/373
Domestic Patent References:
| WO2014199650A1 | 2014-12-18 | |||
| WO2018008450A1 | 2018-01-11 | |||
| WO2013145961A1 | 2013-10-03 | |||
| WO2014199650A1 | 2014-12-18 |
Foreign References:
| JP2011006586A | 2011-01-13 | |||
| JP2015006980A | 2015-01-15 | |||
| JP2011006586A | 2011-01-13 |
Other References:
See also references of EP 3575368A4
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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