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Title:
RESIN MEMBER, REEL BODY, AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/058107
Kind Code:
A1
Abstract:
Disclosed is a resin member including: a resin component which develops adhesive properties due to being irradiated with light; and a light radical generating agent. The storage modulus at 25°C of the resin member is 400 kPa or more. The storage modulus at 25°C of the resin member after being irradiated with exposure light of 30 J/cm2 is 200 kPa or less.

Inventors:
MIYAMOTO YUKI (JP)
KONDOU HIDEKAZU (JP)
SAITO KOICHI (JP)
Application Number:
PCT/JP2023/033005
Publication Date:
March 21, 2024
Filing Date:
September 11, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C08L101/00; C08G18/38; C08G18/50; C08G18/52
Domestic Patent References:
WO2020209268A12020-10-15
WO2023100861A12023-06-08
Foreign References:
JP2017145276A2017-08-24
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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