Title:
RESIN-MODIFIED FILLER, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/125760
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a resin-modified filler exhibiting excellent anti-blocking properties, and contributing fluidity to an epoxy resin composition; an epoxy resin composition using the same; and a cured product thereof. This resin-modified filler is one containing an inorganic filler (a) and an epoxy resin (b) having an average of 2-10 epoxy groups in each molecule, wherein the weight ratio of (a) to (b) is (a):(b)=70:30-98:2, and the lengthwise diameter thereof is 5cm or less.
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Inventors:
NAKANISHI MASATAKA (JP)
Application Number:
PCT/JP2015/054217
Publication Date:
August 27, 2015
Filing Date:
February 17, 2015
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C09C1/00; C08L63/00; C09C3/08; C09C3/10
Foreign References:
| JP2013203928A | 2013-10-07 | |||
| JP2009120815A | 2009-06-04 | |||
| JPH09216939A | 1997-08-19 | |||
| JPH0794641A | 1995-04-07 |
Attorney, Agent or Firm:
Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
Patent business corporation Shin-Ei Patent Firm (JP)
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