Title:
RESIN MOLD MATERIAL COMPOSITION FOR IMPRINTING
Document Type and Number:
WIPO Patent Application WO/2013/154112
Kind Code:
A1
Abstract:
Provided are: a resin mold material and a resin replica mold material composition for imprinting having superior mold release characteristics; a resin mold and resin replica mold resulting from containing the material composition; and a method for producing same. The resin mold material or resin replica mold material composition for imprinting contains 100 parts by weight of a mold resin or replica mold resin for imprinting and 0.1-10 parts by weight of a curable fluoropolymer (A). Preferably, the fluoropolymer (A) has a weight average molecular weight of 3,000-20,000 and results from including as repeating units (a1) an α-position substituted acrylate having a fluoroalkyl group having 4-6 carbon atoms and (a2) and 5-120 parts by weight of a high-softening-point monomer exhibiting a glass transition point or softening point of at least 50°C in the homopolymer state.
Inventors:
YAMASHITA TSUNEO
MORITA MASAMICHI
KUWAJIMA YOSHIKO
MORITA MASAMICHI
KUWAJIMA YOSHIKO
Application Number:
PCT/JP2013/060749
Publication Date:
October 17, 2013
Filing Date:
April 09, 2013
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
International Classes:
B29C33/40; B29C59/02; H01L21/027; B29K27/12; B29K33/04
Foreign References:
| JP2011222732A | 2011-11-04 | |||
| JP2010206189A | 2010-09-16 | |||
| JP2008006819A | 2008-01-17 | |||
| JP2009227937A | 2009-10-08 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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