RESIN MOLD FOR NANOIMPRINTING AND MANUFACTURING METHOD THEREOF

Title:

RESIN MOLD FOR NANOIMPRINTING AND MANUFACTURING METHOD THEREOF

Document Type and Number:

WIPO Patent Application WO/2012/018048

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a resin mold for nanoimprinting that has excellent, transfer defect-free releasability with the resin to be imprinted, and does not produce defects due to imprinting. The present invention also addresses the problem of providing a resin mold for nanoimprinting that does not produce peeling of the substrate and each layer when imprinting. This resin mold for nanoimprinting comprises: a substrate; a resin layer formed on the substrate and having an irregular pattern on the surface; an inorganic layer formed with a uniform thickness on the resin layer, at least on the surface having the irregular pattern on the surface; and a mold releasing agent layer formed with a uniform thickness on the inorganic layer, at least on the surface having the irregular pattern on the surface. The resin of the resin layer contains 1 to 50% of a constitutional unit derived from an epoxy group-containing unsaturated compound with respect to all constitutional units, and the epoxy value is 7.0 × 10-4 to 4.0 × 10-2.

Inventors:

YAMADA HIROKO (JP)
MIZAWA TAKEHIDE (JP)

Application Number:

PCT/JP2011/067775

Publication Date:

February 09, 2012

Filing Date:

August 03, 2011

Export Citation:

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Assignee:

SOKEN KAGAKU KK (JP)
YAMADA HIROKO (JP)
MIZAWA TAKEHIDE (JP)

International Classes:

B29C59/02; B29C33/40; B29C33/56; H01L21/027; B29K33/04

Domestic Patent References:

WO2009148138A1	2009-12-10
WO2011016549A1	2011-02-10

Foreign References:

JP2008006820A	2008-01-17
JP2007335873A	2007-12-27
JP2008068612A	2008-03-27
JP2009184117A	2009-08-20
JP2010113772A	2010-05-20
JP2008282467A	2008-11-20
JP2003306520A	2003-10-31

Other References: