Title:
RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2016/208114
Kind Code:
A1
Abstract:
A resin molded article is provided with a heat-curable resin member (10) and a thermoplastic resin member (20) which seals a sealing surface (11) of the heat-curable resin member. An exposure surface (12) of the heat-curable resin member is exposed on the thermoplastic resin member. An additive (20a) containing a functional group is added to the thermoplastic resin member, and the heat-curable resin member has a surface layer (11a) which is formed as a part of the sealing surface and which comprises a heat-curable resin containing a carboxyl group or a phenol group at a higher concentration than that in an underlayer-constituting part of the heat-curable resin. The carboxyl group or the phenol group present in the surface layer is chemically bonded to the functional group present in the additive. The adhesion between the heat-curable resin member and the thermoplastic resin member can be improved through this chemical bonding.
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Inventors:
YAMAKAWA HIROYUKI (JP)
IZUMI RYOSUKE (JP)
IZUMI RYOSUKE (JP)
Application Number:
PCT/JP2016/002313
Publication Date:
December 29, 2016
Filing Date:
May 12, 2016
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
B29C45/14; B32B27/18; B32B27/38; H01L23/29; H01L23/31
Domestic Patent References:
| WO2014013697A1 | 2014-01-23 | |||
| WO2015129237A1 | 2015-09-03 |
Foreign References:
| JP2013217330A | 2013-10-24 | |||
| JPH07326691A | 1995-12-12 | |||
| JP2012045730A | 2012-03-08 | |||
| JPH09246446A | 1997-09-19 |
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
Gold Junki (JP)
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