Title:
RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/111731
Kind Code:
A1
Abstract:
The objective of the present invention is to enhance the reliability of sealing performance. A resin molded article (M) according to the present invention includes: a primary molding part (11) formed from a synthetic resin material; an electric wire (26) the front end of which is embedded in the primary molding part (11); a sensor (22) which is connected to the front end of the electric wire (26) in the primary molding part (11)
and is disposed so as to be partially exposed from the outer surface of the primary molding part (11); a cylindrical sealing member (16) which is in liquid-tight contact with the periphery of the primary molding part (11) at an area rearward of the exposed part (22E) of the sensor (22); and a secondary molding part (17) which is in liquid-tight contact with the periphery of the sealing member (16) and surrounds at least the entirety of the area of the primary molding part (11) forward of the sealing member (16).
Inventors:
KATO KOICHI (JP)
KIM KYUNGWOO (JP)
KIM KYUNGWOO (JP)
Application Number:
PCT/JP2018/043219
Publication Date:
June 13, 2019
Filing Date:
November 22, 2018
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
B29C45/14; B29C45/26; G01D5/245; G01P1/02; H01B7/00
Domestic Patent References:
| WO2014103499A1 | 2014-07-03 | |||
| WO2015115288A1 | 2015-08-06 |
Foreign References:
| JP2014130100A | 2014-07-10 | |||
| JP2003177171A | 2003-06-27 | |||
| US6253614B1 | 2001-07-03 | |||
| JP2008209197A | 2008-09-11 |
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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