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Title:
RESIN MOLDED BODY AND BLUE LIGHT CUT LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2018/180929
Kind Code:
A1
Abstract:
Provided are a resin molded body and applications thereof, wherein the resin molded body is provided with: a resin layer that contains a resin and a compound represented by general formula (1); and, on at least one of the surfaces of the resin layer, a protective layer that contains at least one substance selected from a group consisting of urethane resins, acrylic resins, and polysiloxane. In general formula (1), Het1 represents an aromatic heterocyclic residue having a bivalent five-membered or six-membered ring. Each of Xa, Xb, Xc, and Xd represents, independently of each other, a hetero atom, and each of Ya, Yb, Yc, Yd, Ye, and Yf represents, independently of each other, a hetero atom or a carbon atom. The ring bonded to Het1 may have a double bond at an arbitrary position.

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Inventors:
KASAHARA TAKEHIRO (JP)
NAKAGAWA YUKI (JP)
Application Number:
PCT/JP2018/011526
Publication Date:
October 04, 2018
Filing Date:
March 22, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B27/18; B32B27/30; B32B27/40; C08J5/18; C08K5/35; C08K5/45; C08L101/00; G02B1/04; G02B1/11; G02B5/22; G02C7/00; G02C7/10
Domestic Patent References:
WO2016098713A12016-06-23
WO2009122968A12009-10-08
Foreign References:
JP2011065139A2011-03-31
JP2013194136A2013-09-30
JP2007017555A2007-01-25
JP2014223794A2014-12-04
JP2010132846A2010-06-17
JP2010259624A2010-11-18
JP2006289627A2006-10-26
JP2015129909A2015-07-16
JP2013225461A2013-10-31
JP2006028280A2006-02-02
JP2017071851A2017-04-13
Other References:
D. W. VAN CREVELEN: "Properties of Polymer", 1976, ELSEVIER SCIENTIFIC PUBLISHING COMPANY
See also references of EP 3603966A4
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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