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Patent Searching and Data


Title:
RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2011/090139
Kind Code:
A1
Abstract:
Disclosed is a resin molded body, which is a laminate obtained by laminating two resin layers having different heat distortion temperatures, and which is characterized in that a resin layer having the lower heat distortion temperature has a thickness TL of not more than 0.3 mm and the resin layer having the lower heat distortion temperature is provided with a patterned shape with a height TP (TL > TP) by thermal nanoimprinting. The resin molded body has a fine patterned shape transferred onto the surface thereof, said transferred patterned shape having dimensions that have excellent consistency with the dimensions of the patterned shape of the mold.

Inventors:
HAYASHIDA Taizou (9-2 Higashi-Shinbashi 1-chome, Minato-k, Tokyo 40, 〒1058640, JP)
林田 大造 (〒40 東京都港区東新橋一丁目9番2号 JSR株式会社内 Tokyo, 〒1058640, JP)
Application Number:
JP2011/051016
Publication Date:
July 28, 2011
Filing Date:
January 20, 2011
Export Citation:
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Assignee:
JSR Corporation (9-2 Higashi-Shinbashi 1-chome, Minato-ku Tokyo, 40, 〒1058640, JP)
JSR株式会社 (〒40 東京都港区東新橋一丁目9番2号 Tokyo, 〒1058640, JP)
HAYASHIDA Taizou (9-2 Higashi-Shinbashi 1-chome, Minato-k, Tokyo 40, 〒1058640, JP)
International Classes:
B29C59/02; B32B27/08; C08G61/00; B29K23/00; B29K101/12; B29L9/00
Attorney, Agent or Firm:
KOJIMA Seiji (JINGUHIGASHI ATSUTA Bldg, 4F.,8-20, Jingu 3-chome, Atsuta-ku, Nagoya-shi, Aichi 31, 〒4560031, JP)
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Claims: