RESIN MOLDED BODY

Title:

RESIN MOLDED BODY

Document Type and Number:

WIPO Patent Application WO/2011/090139

Kind Code:

A1

Abstract:

Disclosed is a resin molded body, which is a laminate obtained by laminating two resin layers having different heat distortion temperatures, and which is characterized in that a resin layer having the lower heat distortion temperature has a thickness TL of not more than 0.3 mm and the resin layer having the lower heat distortion temperature is provided with a patterned shape with a height TP (TL > TP) by thermal nanoimprinting. The resin molded body has a fine patterned shape transferred onto the surface thereof, said transferred patterned shape having dimensions that have excellent consistency with the dimensions of the patterned shape of the mold.

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Inventors:

HAYASHIDA TAIZOU (JP)
MOGI TAKESHI (JP)

Application Number:

PCT/JP2011/051016

Publication Date:

July 28, 2011

Filing Date:

January 20, 2011

Export Citation:

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Assignee:

JSR CORP (JP)
HAYASHIDA TAIZOU (JP)
MOGI TAKESHI (JP)

International Classes:

B29C59/02; B32B7/027; B32B27/08; C08G61/00; B29K23/00; B29K101/12; B29L9/00

Domestic Patent References:

WO2007066712A1

2007-06-14

Foreign References:

JP2004177805A	2004-06-24
JP2009214298A	2009-09-24
JP2007062372A	2007-03-15
JP2009255411A	2009-11-05
JP2006297910A	2006-11-02

Attorney, Agent or Firm:

KOJIMA SEIJI (JP)
Seiji Kojima (JP)

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