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Title:
RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/199008
Kind Code:
A1
Abstract:
Provided is a resin molded body which has excellent electromagnetic wave shielding performance in a high-frequency region of 1 GHz or more. This resin molded body contains a thermoplastic resin, a plate-like graphite, and at least one of carbon black and metal fibers, and is configured such that: the content of the plate-like graphite is from 50 parts by weight to 200 parts by weight (inclusive) relative to 100 parts by weight of the thermoplastic resin; the DBP oil absorption of the carbon black is from 100 ml/100 g to 600 ml/100 g (inclusive); the diameters of the metal fibers are from 5 μm to 20 μm (inclusive); the fiber lengths of the metal fibers are from 2 mm to 12 mm (inclusive); and the content of at least one of the carbon black and the metal fibers is from 1 part by weight to 50 parts by weight (inclusive) relative to 100 parts by weight of the thermoplastic resin.

Inventors:
MATSUMURA, Ryuuji (1-1, Sanjo-oji 4cho-me, Nara-sh, Nara 55, 〒6308555, JP)
SUENAGA, Yuusuke (1-1, Sanjo-oji 4cho-me, Nara-sh, Nara 55, 〒6308555, JP)
MASUDA, Takuya (1-1, Sanjo-oji 4cho-me, Nara-sh, Nara 55, 〒6308555, JP)
AKIYAMA, Takafumi (1-1, Sanjo-oji 4cho-me, Nara-sh, Nara 55, 〒6308555, JP)
Application Number:
JP2018/016421
Publication Date:
November 01, 2018
Filing Date:
April 23, 2018
Export Citation:
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Assignee:
SEKISUI TECHNO MOLDING CO., LTD. (6-2 Nishi-Shinbashi 2cho-me, Minato-ku Tokyo, 03, 〒1050003, JP)
International Classes:
C08L101/00; C08K3/04; C08K7/00; C08K7/04; H05K7/20; H05K9/00
Domestic Patent References:
WO2016063855A12016-04-28
WO2009075322A12009-06-18
Foreign References:
JP2006257174A2006-09-28
JP2003258491A2003-09-12
JP2016204570A2016-12-08
JPH097159A1997-01-10
JP2004095847A2004-03-25
JP2011192714A2011-09-29
JPS5672049A1981-06-16
JP2016111362A2016-06-20
JPS5225558B11977-07-08
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-ku, Osaka-sh, Osaka 28, 〒5400028, JP)
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