Title:
RESIN MOLDED COMPONENT, BATTERY PACK, AND INSPECTION METHOD FOR RESIN MOLDED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/106680
Kind Code:
A1
Abstract:
An injection-molded resin molded component having: an external surface section having a gate mark formed thereupon; and an internal surface section on the opposite side to the external surface section and having resin break marks formed thereupon.
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Inventors:
TAKATSUJI HIDEYASU (JP)
Application Number:
PCT/JP2020/042776
Publication Date:
June 03, 2021
Filing Date:
November 17, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
B29C45/00; B29C33/42; B29C45/17; B29C45/76
Foreign References:
| JP2002178355A | 2002-06-26 | |||
| JPS56167264A | 1981-12-22 | |||
| JP2014038819A | 2014-02-27 |
Attorney, Agent or Firm:
SUGIURA, Takuma et al. (JP)
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