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Patent Searching and Data


Title:
RESIN MOLDED PRODUCT AND METHOD FOR PRODUCING RESIN MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2020/246373
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide a resin molded product in which a metal terminal is less likely to be displaced or deformed during resin molding and the exposed surface of a metal terminal is less likely to be covered by resin, and a method for producing a resin molded product. In a method for producing a resin molded product in which an electrical conductor 2a is arranged in molds 6,7 and resin is injected, molds 6,7 are equipped with a protruding portion 7a having an inclined surface 7aa on the upstream side in resin flow direction A1. The inclined surface 7aa is inclined so as to approach the electrical conductor 2a heading towards the downstream side of resin flow along resin flow direction A1. The electrical conductor 2a is arranged inside molds 6,7 so that at least part of the inclined surface 7aa in resin flow direction A1 faces the rear surface 2ab of an exposed surface 2aa where the electrical conductor 2a is exposed from the resin.

Inventors:
SATO SHUN (JP)
SUTOU MITSURU (JP)
UENODAN AKIRA (JP)
Application Number:
PCT/JP2020/021295
Publication Date:
December 10, 2020
Filing Date:
May 29, 2020
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
B29C33/12; B29C45/14; B29C33/42; B29C45/26; H01L21/56; H01L23/28; H01L23/50; H01R43/24
Foreign References:
JP2004095965A2004-03-25
JP2011119489A2011-06-16
JPS61102040A1986-05-20
Attorney, Agent or Firm:
TODA Yuji (JP)
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