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Patent Searching and Data


Title:
RESIN MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2011/046062
Kind Code:
A1
Abstract:
Provided is a resin molded product in which a lid body is prevented from being erroneously mounted. An upper bumper (1) is molded from synthetic resin such that a product body (1h) thereof has a predetermined thickness (T). The product body (1h) is provided with a recessed portion (1a) that can accommodate a head portion (5a) of a bolt (5). The upper bumper (1) is provided with a cap (1b) that covers an opening (11k) of the recessed portion (1a). The upper bumper (1) is further provided with a band-shaped hinge body (1c) that connects the cap (1b) and the product body (1h) and has a bendable thin thickness (t). The product body (1h), the cap (1b), and the hinge body (1c) are integrally molded while the hinge body (1c) is developed. Consequently, the cap (1b) having a color difference can be prevented from being erroneously mounted to the product body (1h).

Inventors:
MINATO NOBUHIRO (JP)
NOGAWA NARUTO (JP)
ENDOU MASAHARU (JP)
Application Number:
PCT/JP2010/067651
Publication Date:
April 21, 2011
Filing Date:
October 07, 2010
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
MINATO NOBUHIRO (JP)
NOGAWA NARUTO (JP)
ENDOU MASAHARU (JP)
International Classes:
B60R19/24
Foreign References:
JPH0867221A1996-03-12
JP2005215514A2005-08-11
JPH10329629A1998-12-15
JPH0448156U1992-04-23
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki et al. (JP)
Right wood Masayuki (JP)
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