Title:
RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/111860
Kind Code:
A1
Abstract:
A movable die (32) has a main-body die part (40), a separate-body die part (41) configured as a separate body from the main-body die part (40), and a relative movement mechanism (42) for causing the separate-body die part (41) to move relative to the main-body die part (40) in a drive direction of a mold driving device (33).
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Inventors:
SUGIYAMA DAISUKE (JP)
TANIMURA TOSHIKAZU (JP)
TANIMURA TOSHIKAZU (JP)
Application Number:
PCT/JP2018/044430
Publication Date:
June 13, 2019
Filing Date:
December 03, 2018
Export Citation:
Assignee:
NANJO AUTO INTERIOR CO LTD (JP)
International Classes:
B29C44/34; B29C44/42; B29C45/26; B29C45/70; B29K101/12; B29K105/04; B29L9/00
Foreign References:
JP2009248389A | 2009-10-29 | |||
JPS5878733A | 1983-05-12 | |||
JP2006232187A | 2006-09-07 | |||
JP2007216529A | 2007-08-30 | |||
JPH08290441A | 1996-11-05 | |||
JPH0885132A | 1996-04-02 | |||
JP2007160736A | 2007-06-28 | |||
JP2016117198A | 2016-06-30 | |||
JP2012111118A | 2012-06-14 | |||
JP2009078471A | 2009-04-16 | |||
JP2012066485A | 2012-04-05 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
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