Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN MOLDING APPARATUS AND RESIN MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/111860
Kind Code:
A1
Abstract:
A movable die (32) has a main-body die part (40), a separate-body die part (41) configured as a separate body from the main-body die part (40), and a relative movement mechanism (42) for causing the separate-body die part (41) to move relative to the main-body die part (40) in a drive direction of a mold driving device (33).

Inventors:
SUGIYAMA DAISUKE (JP)
TANIMURA TOSHIKAZU (JP)
Application Number:
PCT/JP2018/044430
Publication Date:
June 13, 2019
Filing Date:
December 03, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NANJO AUTO INTERIOR CO LTD (JP)
International Classes:
B29C44/34; B29C44/42; B29C45/26; B29C45/70; B29K101/12; B29K105/04; B29L9/00
Foreign References:
JP2009248389A2009-10-29
JPS5878733A1983-05-12
JP2006232187A2006-09-07
JP2007216529A2007-08-30
JPH08290441A1996-11-05
JPH0885132A1996-04-02
JP2007160736A2007-06-28
JP2016117198A2016-06-30
JP2012111118A2012-06-14
JP2009078471A2009-04-16
JP2012066485A2012-04-05
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Download PDF: