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Patent Searching and Data


Title:
RESIN MOLDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/137386
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin molding apparatus capable of responding to a need for various products by joint use of a transfer molding device and a compression molding device without significant modification of the devices. As a means of solving this problem, in a press part (C), an unmolded resin (R1) is supplied to a lower mold (16) without the use of a dedicated machine, the unmolded resin (R1) is pressure-fed to a cavity by a transfer molding device (13) and transfer molded, the unmolded resin (R1) supplied into the lower mold cavity is caused to overflow by a compression molding device (18), and any device used in the case of compression molding can be selected and used.

Inventors:
NAKAMURA KAZUO (JP)
NISHIZAWA YOSHIAKI (JP)
KITAJIMA TOKUYUKI (JP)
ITO SACHIO (JP)
Application Number:
PCT/JP2019/047313
Publication Date:
July 02, 2020
Filing Date:
December 04, 2019
Export Citation:
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Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C45/02; B29C31/04; B29C45/14; H01L21/56
Foreign References:
JP2013042017A2013-02-28
JP2003229444A2003-08-15
JP2018192712A2018-12-06
JP2015013371A2015-01-22
JP2005136193A2005-05-26
JP2001030295A2001-02-06
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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