Title:
RESIN MOLDING DEVICE, RESIN MOLDING METHOD, BLOOD PURIFICATION CIRCUIT PANEL AND HOLLOW MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2016/171209
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a resin molding device that can prevent a resin sheet from becoming wound around a roller while the resin sheet is being drawn. The present invention provides a resin molding device comprising the following: an extrusion device from which a resin sheet is extruded from an extrusion slit and caused to hang; a molding mold used to mold the resin sheet; and a roller disposed between the extrusion device and the molding mold. The roller is disposed only on one side of the resin sheet at a height position of the resin sheet, and is disposed so as to be in contact with the resin sheet in order to change the trajectory of the resin sheet.
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Inventors:
AIHARA KOUSUKE (JP)
YAMAZAKI DAISUKE (JP)
SANO TAKERU (JP)
YAMAZAKI DAISUKE (JP)
SANO TAKERU (JP)
Application Number:
PCT/JP2016/062627
Publication Date:
October 27, 2016
Filing Date:
April 21, 2016
Export Citation:
Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C49/04; B29C51/10
Foreign References:
| JPH04270627A | 1992-09-28 | |||
| JPS61261021A | 1986-11-19 | |||
| JP2008302565A | 2008-12-18 | |||
| JPH01154725A | 1989-06-16 | |||
| JP2011073422A | 2011-04-14 | |||
| JPS54112965A | 1979-09-04 | |||
| JP2012240361A | 2012-12-10 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)
SK patent business corporation (JP)
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