Title:
RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2017/038254
Kind Code:
A1
Abstract:
Provided is a resin molding device capable of suppressing variations in the thickness of a resin molded article. A resin molding device 10 is provided with: a first platen 11 and a second platen 12 (outer peripheral load platens) that are two plate-shaped members arranged in parallel and between which a molding mold 16 is arranged in a mold arrangement part 1611, which is a central part of the plate-shaped members; a force application part (a toggle link 133 and tie bars 132) that applies a force from load points 171 and 172 outside the mold arrangement part 1611 to the first platen 11 and the second platen 12; a heating mechanism (a lower heater plate 151 and an upper heater plate 152) provided between the outer peripheral load platens and the molding mold 16; and heat insulation members (a lower heat insulation member 141 and an upper heat insulation member 142) each of which includes a plurality of elastic column-shaped members 14A arranged between the respective outer peripheral load platen and the heating mechanism, and each of which is set such that a deformation amount of the respective column-shaped members 14A increases from the center of the mold arrangement part 1611 toward the load points 171 and 172.
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Inventors:
OKUNISHI YOSHITO (JP)
TAKASE SHINJI (JP)
KAWAKUBO KAZUKI (JP)
TAKASE SHINJI (JP)
KAWAKUBO KAZUKI (JP)
Application Number:
PCT/JP2016/070231
Publication Date:
March 09, 2017
Filing Date:
July 08, 2016
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B29C43/32; H01L21/56
Foreign References:
| JP2015005611A | 2015-01-08 | |||
| JPH1094864A | 1998-04-14 | |||
| JP2004042356A | 2004-02-12 |
Attorney, Agent or Firm:
KYOTO INTERNATIONAL PATENT LAW OFFICE (JP)
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