RESIN MOLDING DIE, METHOD FOR MANUFACTURING RESIN MOLDING DIE, METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE, AND SYSTEM FOR MANUFACTURING RESIN MOLDED ARTICLE

WIPO Patent Application WO/2021/124581

A1

In order to provide a resin molded article having a desired surface shape, a resin molding die capable of manufacturing said resin molded article and a method for manufacturing the resin molding die, and a resin molding die manufacturing system for realizing the manufacture of a resin molding die, a resin molding die 1 according to the present invention comprises a die body 2, and a resin layer 4 having a thickness of 50-800 µm which is formed so as to be exposed toward a die surface 22 of the die body 2 and which is a heat-resistant composite material including a synthetic resin 4a, a ceramic particulate 4b, and a dilution solvent 4c. The resin molding die 1 according to the present invention comprises: a die body 2; and a resin layer 4 that is a heat-resistant composite material containing a synthetic resin 4a, a ceramic particulate 4b, and a dilution solvent 4c, the resin layer 4 being formed exposed toward the die surface 22 of the die body 2. Some of the resin layer 4 is excavated to form recess and protrusions 6.

SOGABE MITSUSHI (JP)
EURICH MELANIE (DE)
EURICH FREDERIK (DE)

PCT/JP2019/050213

June 24, 2021

December 20, 2019

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TANAZAWA HAKKOSHA KK (JP)
ESCHMANN TEXTURES INT GMBH (DE)

B29C33/38; B29C33/42

WO2008065946A1	2008-06-05
WO2016059937A1	2016-04-21
WO2012117881A1	2012-09-07

JP2001062842A	2001-03-13
JP2016112609A	2016-06-23
JP2017007114A	2017-01-12
JP2005018532A	2005-01-20
JP2007160637A	2007-06-18

See also references of EP 4079482A4

OKADA, Masahiro (JP)

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