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Patent Searching and Data


Title:
RESIN MOLDING MACHINE AND RESIN MOLDING PROCESS
Document Type and Number:
WIPO Patent Application WO/2007/032052
Kind Code:
A1
Abstract:
Conventional production of plastic articles not releasing harmful organic molecules requires a high injection or extrusion pressure in order to avoid the heating of resin to high temperature, resulting in the use of a large-sized and heavy resin molding machine having high electric power consumption. The employment of a means for inhibiting oxidative decomposition and catalytic decomposition enables the formation of a molten plastic having an extremely low viscosity without decomposition or dissociation even at high temperature, whereby the molding of resin can be conducted at a very low injection or extrusion pressure to attain the downsizing and weight saving of the molding machine.

Inventors:
OHMI TADAHIRO (JP)
Application Number:
PCT/JP2005/016734
Publication Date:
March 22, 2007
Filing Date:
September 12, 2005
Export Citation:
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Assignee:
OHMI TADAHIRO (JP)
International Classes:
B29C45/24; B29C45/26
Foreign References:
JP2004262133A2004-09-24
JP2002225105A2002-08-14
JP2005119124A2005-05-12
JPH08160567A1996-06-21
JP2005007835A2005-01-13
JP2005178250A2005-07-07
JPH11314259A1999-11-16
JPS605869A1985-01-12
JPH0857923A1996-03-05
JP2001170955A2001-06-26
JP2003114436A2003-04-18
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (4-10 Nishishinbashi 1-chome,, Minato-k, Tokyo03, JP)
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