Title:
RESIN MOLDING MACHINE AND RESIN MOLDING PROCESS
Document Type and Number:
WIPO Patent Application WO/2007/032052
Kind Code:
A1
Abstract:
Conventional production of plastic articles not releasing harmful organic
molecules requires a high injection or extrusion pressure in order to avoid the
heating of resin to high temperature, resulting in the use of a large-sized and
heavy resin molding machine having high electric power consumption. The employment
of a means for inhibiting oxidative decomposition and catalytic decomposition
enables the formation of a molten plastic having an extremely low viscosity without
decomposition or dissociation even at high temperature, whereby the molding
of resin can be conducted at a very low injection or extrusion pressure to attain
the downsizing and weight saving of the molding machine.
Inventors:
OHMI TADAHIRO (JP)
Application Number:
PCT/JP2005/016734
Publication Date:
March 22, 2007
Filing Date:
September 12, 2005
Export Citation:
Assignee:
OHMI TADAHIRO (JP)
International Classes:
B29C45/24; B29C45/26
Foreign References:
JP2004262133A | 2004-09-24 | |||
JP2002225105A | 2002-08-14 | |||
JP2005119124A | 2005-05-12 | |||
JPH08160567A | 1996-06-21 | |||
JP2005007835A | 2005-01-13 | |||
JP2005178250A | 2005-07-07 | |||
JPH11314259A | 1999-11-16 | |||
JPS605869A | 1985-01-12 | |||
JPH0857923A | 1996-03-05 | |||
JP2001170955A | 2001-06-26 | |||
JP2003114436A | 2003-04-18 |
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (4-10 Nishishinbashi 1-chome,, Minato-k, Tokyo03, JP)
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