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Patent Searching and Data


Title:
RESIN MOLDING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2007/055338
Kind Code:
A1
Abstract:
Disclosed is a resin molding material having remarkably excellent wear resistance while maintaining good mechanical strength. The resin molding material is improved in deterioration of wear resistance caused by an abrasive powder produced from inorganic substances, particularly from glass fibers or the like. Specifically disclosed is a resin molding material containing a resin, a carbon substance and an inorganic substance. The carbon substance contains an adhesive carbon substance.

Inventors:
KAYA MICHIKO (JP)
ODA HIROTO (JP)
INADA TEIICHI (JP)
Application Number:
PCT/JP2006/322503
Publication Date:
May 18, 2007
Filing Date:
November 10, 2006
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
KAYA MICHIKO (JP)
ODA HIROTO (JP)
INADA TEIICHI (JP)
International Classes:
C08L101/00; C08K3/00; C08K7/06; C08K7/14; C08K7/18; C08L61/06; F16D69/02
Foreign References:
JP2004256687A2004-09-16
JPH10168279A1998-06-23
JP2005048009A2005-02-24
JPH10226752A1998-08-25
JP2005307090A2005-11-04
JP2005171215A2005-06-30
Other References:
See also references of EP 1947146A4
Attorney, Agent or Firm:
HIRASAWA, Kenichi et al. (Bridgestone Toranomon Bldg. 6F. 25-2, Toranomon 3-chom, Minato-ku Tokyo 01, JP)
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