Title:
RESIN MOLDING METHOD AND MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2017/033580
Kind Code:
A1
Abstract:
This resin molding method for forming a resin molding 24 on a surface of a panel 1 is provided with: a molding die installation step for installing a molding die 3 formed of an elastic body on the panel 1 so as to form a cavity 7 by means of a molding surface 10 of the molding die 3; a resistance increasing step for increasing resistance to pressure applied from the cavity 7 side onto the molding surface 10; a resin injection step for injecting a resin into the cavity 7; and a resin curing step for curing the injected resin.
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Inventors:
IKADAI YOSUKE (JP)
TSUCHIYA TAKASHI (JP)
NOGUCHI MASATO (JP)
TSUCHIYA TAKASHI (JP)
NOGUCHI MASATO (JP)
Application Number:
PCT/JP2016/069895
Publication Date:
March 02, 2017
Filing Date:
July 05, 2016
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B29C39/24; B29C35/08; B29C39/10; B29C39/26
Foreign References:
| JPH07329078A | 1995-12-19 | |||
| JPH08159288A | 1996-06-21 | |||
| JP2013256015A | 2013-12-26 |
Attorney, Agent or Firm:
SATO & ASSOCIATES (JP)
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