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Title:
RESIN MOLDING AND MOLDING METHOD FOR RESIN MOLDING
Document Type and Number:
WIPO Patent Application WO/2019/150760
Kind Code:
A1
Abstract:
Provided are: a resin molding formed by gas pressure molding in which a sealing means for a resin molding die is not required and which is not limited by a parting line, and which can achieve both weight reduction by thinning of the resin molding and reinforcement thereof; and a molding method for the resin molding. A front cover 52 is molded by applying pressurized gas on molten resin inside a resin molding die 75. For the front cover 52, a gas seal rib 52d is integrally formed in a wall section 52x and the gas seal rib 52d is disposed so as to surround a designated area of the wall section 52x. The thickness of the wall section 52x of the portion surrounded by the gas seal rib 52d is formed to be thinner than the thickness of other regions of the wall section 52x.

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Inventors:
OGI HIDEO (JP)
KOEZUKA KIMIHIKO (JP)
Application Number:
PCT/JP2018/044748
Publication Date:
August 08, 2019
Filing Date:
December 05, 2018
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B29C45/00; B29C45/26
Foreign References:
JPH0866933A1996-03-12
JP2006347002A2006-12-28
JP2006069353A2006-03-16
JP2008018588A2008-01-31
Attorney, Agent or Firm:
KUSHIBUCHI & ASSOCIATES (JP)
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