Title:
RESIN-MOLDING MOLD
Document Type and Number:
WIPO Patent Application WO/2017/018006
Kind Code:
A1
Abstract:
Provided is a resin-molding mold that is capable of improving texture by controlling how luster is created in a resin molded product having a grain texture, and is capable of suppressing white blurring from occurring on a surface of the resin molded product on which a molded grain texture is provided. This resin-molding mold 10 is a resin-molding mold for molding a resin molded product having a grain texture. The resin-molding mold 10 comprises a molding mold 12, and a buffer layer 16 formed on a mold surface on the inner side of the molding mold 12. The buffer layer 16 is formed from a mixture including a thermosetting resin and substantially spherical fine particles 18. The bulk specific gravity of the fine particles 18 is from 0.4 g/ml to 0.9 g/ml inclusive. A surface of the buffer layer 16 has a plurality of substantially spherical gloss-adjusting projections 20 formed on the basis of the fine particles 18.
Inventors:
SAKAI MASAYUKI (JP)
AOTA HISAO (JP)
AOTA HISAO (JP)
Application Number:
PCT/JP2016/062083
Publication Date:
February 02, 2017
Filing Date:
April 15, 2016
Export Citation:
Assignee:
TANAZAWA HAKKOSHA KK (JP)
International Classes:
B29C33/38; B29C59/02
Domestic Patent References:
| WO2007015390A1 | 2007-02-08 | |||
| WO1995035194A1 | 1995-12-28 |
Foreign References:
| JPS536358A | 1978-01-20 | |||
| JPS499588A | 1974-01-28 |
Attorney, Agent or Firm:
OKADA, Masahiro (JP)
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