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Patent Searching and Data


Title:
RESIN MOLDING
Document Type and Number:
WIPO Patent Application WO/2017/154177
Kind Code:
A1
Abstract:
A resin molding has: a sheet-shaped main body; and a mounting seat, which is provided with a wall section that protrudes from one surface of the main body, an expanded section that expands from the protruding edge of the wall section in the direction of the plane of the one surface, and a holding part provided on the expanded section and capable of holding a mounting member, the mounting seat being integrally molded with the main body. The width A of the bottom surface of the wall section is 40% or less of the thickness B of the main body in the area where the wall section is located.

Inventors:
FUJINO HIROAKI (JP)
SHIOKAWA HIROFUMI (JP)
HIRAI YOJI (JP)
Application Number:
JP2016/057642
Publication Date:
September 14, 2017
Filing Date:
March 10, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (?1006606, JP)
International Classes:
F16B5/06; B60R13/02; B60R13/04; F16B19/00
Foreign References:
JPH10318228A1998-12-02
JPS63198814U1988-12-21
Attorney, Agent or Firm:
Taiyo, Nakajima & Kato (?1600022, JP)
Patent business corporation solar international patent firm (?1600022, JP)
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