Title:
RESIN MOULDING DEVICE, AND RESIN MOULDING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/185202
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a technique with which transfer moulding and compression moulding can be freely performed in one resin moulding device. A controller (130) is configured so as to be capable of selectively implementing moulding processing for causing transfer moulding to be performed, and moulding processing for causing compression moulding to be performed. Furthermore, the controller (130) is configured such that the selected and set moulding processing is performed on the basis of an external input result. In the transfer-moulding processing, processing is performed in which a transfer-moulding resin is supplied to a pot, and a plunger is used to pump the transfer-moulding resin into a cavity. In the compression-moulding processing, processing is performed in which a compression-moulding resin is supplied to a cavity. A resin supply unit (120) is configured so as to be capable of selectively supplying, to a moulding die, the transfer-moulding resin and the compression-moulding resin, in accordance with the selected moulding processing.
Inventors:
SATO HISASHI (JP)
TOFUKUJI SHIGEYUKI (JP)
KAWAGUCHI MAKOTO (JP)
TOFUKUJI SHIGEYUKI (JP)
KAWAGUCHI MAKOTO (JP)
Application Number:
PCT/JP2014/060539
Publication Date:
November 20, 2014
Filing Date:
April 11, 2014
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C45/02; B29C43/18; B29C45/14; B29C69/02; H01L21/56
Foreign References:
| JP2012039024A | 2012-02-23 | |||
| JP2013028087A | 2013-02-07 | |||
| JP2010076146A | 2010-04-08 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
A patent business corporation Watanuki international patent and a trademark office (JP)
A patent business corporation Watanuki international patent and a trademark office (JP)
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