Title:
RESIN MULTILAYER SUBSTRATE AND COMPONENT MODULE
Document Type and Number:
WIPO Patent Application WO/2015/118951
Kind Code:
A1
Abstract:
A resin multilayer substrate (101) is provided with a first resin layer (21), a conductor pattern (7) made of a metal foil and disposed so as to cover a part of the first resin layer (21), a conductor via (6) disposed so as to connect to the conductor pattern (7), and a second resin layer (22) disposed so as to overlap the first resin layer (21). The second resin layer (22) has an opening (8) for partially exposing the conductor pattern (7). In plan view, the inner peripheral edge of the opening (8) has a first portion set apart from a conductor via (6) by a first distance and a second portion set apart from the conductor via (6) by a second distance. The distance by which the conductor pattern extends under the second resin layer (22) outwards from the inner peripheral edge of the opening (8) in the first portion is greater than the distance by which the conductor pattern (7) extends under the second resin layer (22) outwards from the inner peripheral edge of the opening (8).
Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2015/051609
Publication Date:
August 13, 2015
Filing Date:
January 22, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/34; H05K3/28
Foreign References:
| JP2009141133A | 2009-06-25 | |||
| JPH08186357A | 1996-07-16 | |||
| JPS60123917U | 1985-08-21 | |||
| JP2010135347A | 2010-06-17 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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