Title:
RESIN MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/262372
Kind Code:
A1
Abstract:
The present invention achieves a resin multilayer substrate in which a protective layer can be easily formed and which can suppress variation in electrical characteristics even when a crack occurs in the protective layer during a bending process in a configuration for forming the protective layer on the surface of a laminate. The resin multilayer substrate is provided with: a laminate formed by laminating first resin layers made of a thermoplastic resin; conductive patterns formed in the laminate; and a protective layer including a second resin layer made of a thermosetting resin. The laminate has a first main surface and a second main surface. In addition, the laminate has a bent section which is bent. A conductive pattern positioned at the bent section among the conductive patterns is formed only inside the laminate. The protective layer is disposed at a position, at which the protective layer covers at least the bent section, in the main surface of the laminate.
Inventors:
BABA TAKAHIRO (JP)
Application Number:
PCT/JP2020/024580
Publication Date:
December 30, 2020
Filing Date:
June 23, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K1/03; H05K3/28
Domestic Patent References:
| WO2016203342A1 | 2016-12-22 | |||
| WO2016117554A1 | 2016-07-28 |
Foreign References:
| JP2009176901A | 2009-08-06 | |||
| JP2018026493A | 2018-02-15 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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