Title:
RESIN MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2015/033785
Kind Code:
A1
Abstract:
Provided is a highly reliable resin multilayer substrate (a resin multilayer substrate comprising a plurality of thermoplastic substrate resin layers that are mainly composed of an LCP), which is not susceptible to defects such as separation between a substrate resin layer/a component and a sealing resin layer, cracks and solder splash even in cases where the resin multilayer substrate is exposed to a process that is accompanied by heating. The present invention is a resin multilayer substrate which is provided with: a multilayer substrate main body that comprises a plurality of substrate resin layers laminated on each other; a component which is mounted on at least one main surface of the multilayer substrate main body; and a sealing resin layer that seals the main surface of the multilayer substrate main body and the component. The substrate resin layers are thermoplastic resin layers that are mainly composed of a liquid crystal polymer. The resin of the sealing resin layer is mainly composed of a silicone resin, and the sealing resin layer has a water vapor transmission rate of 1-52 g/m2·24 hr.
Inventors:
KOBAYASHI TAIKI (JP)
Application Number:
PCT/JP2014/071829
Publication Date:
March 12, 2015
Filing Date:
August 21, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/28; H01L23/12; H01L23/14; H01L23/29; H01L23/31; H05K3/46
Domestic Patent References:
| WO2012039436A1 | 2012-03-29 | |||
| WO2012137962A1 | 2012-10-11 |
Foreign References:
| JP2008198701A | 2008-08-28 | |||
| JP2012209320A | 2012-10-25 | |||
| JP2013162042A | 2013-08-19 | |||
| JP2010163203A | 2010-07-29 | |||
| JPH09307127A | 1997-11-28 | |||
| JP2001244380A | 2001-09-07 | |||
| JP2005101269A | 2005-04-14 |
Attorney, Agent or Firm:
Fukami Patent Office, p. c. (JP)
Patent business corporation Fukami patent firm (JP)
Patent business corporation Fukami patent firm (JP)
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