Title:
RESIN MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/037628
Kind Code:
A1
Abstract:
Provided is a resin multilayer substrate (101), equipped with: a laminate (1) of a plurality of resin layers (2) laminated together; a component (3); at least one first-type conductor pattern (7); and at least one second-type conductor pattern (8) disposed inside the laminate (1) in a space between the resin layers (2). At least part of a contour line of each first-type conductor pattern (7) is in a position overlapping the component (3), and a contour line of each second-type conductor pattern (8) is in a position not overlapping the component (3) at all. Resin parts (15) derived from a resin paste that has a thermosetting resin powder as a main material are disposed along portions of the contour line of each first-type conductor pattern (7) overlapping the component (3) and are adjacent to the outside of the first-type conductor pattern (7). The resin parts (15) are not disposed on portions along the contour line of each second-type conductor pattern (8).
Inventors:
OTSUBO YOSHIHITO (JP)
FUJIMOTO ASATO (JP)
FUJIMOTO ASATO (JP)
Application Number:
PCT/JP2017/016919
Publication Date:
March 01, 2018
Filing Date:
April 28, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
| WO2014188830A1 | 2014-11-27 | |||
| WO2014109139A1 | 2014-07-17 | |||
| WO2014103530A1 | 2014-07-03 |
Foreign References:
| JP2013123031A | 2013-06-20 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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