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Patent Searching and Data


Title:
RESIN PANEL AND FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/033780
Kind Code:
A1
Abstract:
In addition to being designed to make resin panels more lightweight and more rigid, the present invention obtains resin panels that are not warped. The resin panel (1) according to an embodiment of the present invention has a back wall (3), a front wall (2) that faces the back wall (3) with a gap therebetween, and ribs (3a), which are portions of the back wall (3) that have been depressed towards the front wall (2) and welded to the inner surface of the front wall (2). The resin panel (1) is characterized in that: the back wall (3), the front wall (2) and the ribs (3a) are configured by mold-clamping, in a split mold, a first melted resin, which is extruded and flows out of an extruding device to configure the back wall (3) and into which a disc-shaped filler has been mixed, and a second melted resin, which configures the front wall (2) and into which a disc-shaped filler has been mixed; and the longitudinal direction (3a1) of the ribs (3a) is not parallel to the directions of flow of the first melted resin and the second melted resin.

Inventors:
NAKAJIMA SHO (JP)
SUMI TAKEHIKO (JP)
Application Number:
PCT/JP2014/071797
Publication Date:
March 12, 2015
Filing Date:
August 20, 2014
Export Citation:
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Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C51/10; B29C48/07; B29C48/12; B29C48/31; B29C49/04; B29D24/00
Domestic Patent References:
WO2013077198A12013-05-30
Foreign References:
JP2012176604A2012-09-13
JP2011235951A2011-11-24
JP2008265078A2008-11-06
JPS57157726A1982-09-29
JPH10235720A1998-09-08
JP2010201662A2010-09-16
Other References:
See also references of EP 3042749A4
Attorney, Agent or Firm:
MARUYAMA, TAKAO (JP)
Takao Maruyama (JP)
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