Title:
RESIN PANEL AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2019/167817
Kind Code:
A1
Abstract:
Provided is a resin panel that enables suppression of sink-mark generation in a resin molded body. According to the present invention, the resin panel is provided with a hollow resin molded body and a spacer member. This resin panel is configured such that the spacer member is disposed in the resin molded body and has a penetrative or non-penetrative hole, and such that the front and rear surfaces of the spacer member adhere to the resin molded body so as to prevent the hole from becoming a sealed space.
Inventors:
HARASAWA YUKI (JP)
Application Number:
PCT/JP2019/006695
Publication Date:
September 06, 2019
Filing Date:
February 22, 2019
Export Citation:
Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C51/12
Domestic Patent References:
| WO2015194349A1 | 2015-12-23 | |||
| WO2010050242A1 | 2010-05-06 | |||
| WO2014058059A1 | 2014-04-17 |
Foreign References:
| JP2015174371A | 2015-10-05 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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