Title:
RESIN PARTICLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/124137
Kind Code:
A1
Abstract:
This resin particle composition has water-absorbing resin particles and a fixing member layer, and is configured such that, when a caking test is performed in the order of (1) through (5), at least a portion of the particles remain on a sieve used, the sieve having an aperture of 850 μm.
Inventors:
TANABE YUKA (JP)
Application Number:
PCT/JP2021/043855
Publication Date:
June 16, 2022
Filing Date:
November 30, 2021
Export Citation:
Assignee:
SUMITOMO SEIKA CHEMICALS (JP)
International Classes:
C08L101/00; B01J20/26; C08L101/14
Domestic Patent References:
WO2015178481A1 | 2015-11-26 |
Foreign References:
JP2020097731A | 2020-06-25 | |||
JP2007229403A | 2007-09-13 | |||
JP2012218320A | 2012-11-12 | |||
JP2012189346A | 2012-10-04 | |||
JP2013144445A | 2013-07-25 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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