RESIN PARTICLE, CONNECTING MATERIAL, AND CONNECTION STRUCTURE

Title:

RESIN PARTICLE, CONNECTING MATERIAL, AND CONNECTION STRUCTURE

Document Type and Number:

WIPO Patent Application WO/2018/203500

Kind Code:

A1

Abstract:

Provided is a resin particle that can effectively relieve internal stress and effectively suppress occurrence of springback. The resin particle according to the present invention has a ratio of 4% or less of the total number of a T unit represented by general formula: [(R)SiO3/2] and a Q unit represented by general formula: [SiO4/2], to the total number, as 100%, of an M unit represented by general formula: [(R)3SiO1/2], a D unit represented by general formula: [(R)2SiO2/2], the T unit, and the Q unit.

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Inventors:

UEDA SAORI (JP)
YAMADA YASUYUKI (JP)

Application Number:

PCT/JP2018/016745

Publication Date:

November 08, 2018

Filing Date:

April 25, 2018

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Assignee:

SEKISUI CHEMICAL CO LTD (JP)

International Classes:

C08F299/08; C08J3/12

Domestic Patent References:

WO2016088812A1	2016-06-09
WO2011152008A1	2011-12-08
WO2017082353A1	2017-05-18

Foreign References:

JP2016108563A	2016-06-20
JP2009052005A	2009-03-12
JP2013508510A	2013-03-07
JP2017088882A	2017-05-25

Attorney, Agent or Firm:

MIYAZAKI & METSUGI (JP)

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