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Title:
RESIN PARTICLE, CONNECTING MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/203500
Kind Code:
A1
Abstract:
Provided is a resin particle that can effectively relieve internal stress and effectively suppress occurrence of springback. The resin particle according to the present invention has a ratio of 4% or less of the total number of a T unit represented by general formula: [(R)SiO3/2] and a Q unit represented by general formula: [SiO4/2], to the total number, as 100%, of an M unit represented by general formula: [(R)3SiO1/2], a D unit represented by general formula: [(R)2SiO2/2], the T unit, and the Q unit.

Inventors:
UEDA, Saori (1259, Izumi, Minakuchi-cho, Kouka-sh, Shiga 85, 〒5288585, JP)
YAMADA, Yasuyuki (1259, Izumi, Minakuchi-cho, Kouka-sh, Shiga 85, 〒5288585, JP)
Application Number:
JP2018/016745
Publication Date:
November 08, 2018
Filing Date:
April 25, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
International Classes:
C08F299/08; C08J3/12
Domestic Patent References:
WO2016088812A12016-06-09
WO2011152008A12011-12-08
WO2017082353A12017-05-18
Foreign References:
JP2016108563A2016-06-20
JP2009052005A2009-03-12
JP2013508510A2013-03-07
JP2017088882A2017-05-25
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-ku, Osaka-sh, Osaka 28, 〒5400028, JP)
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