Title:
RESIN PARTICLE, ELECTROCONDUCTIVE PARTICLE, ELECTROCONDUCTIVE MATERIAL, AND CONNECTED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/025114
Kind Code:
A1
Abstract:
Provided is a resin particle which makes it possible to bring about increases in the area of contact between the resin particle or a particle comprising the resin particle and an adherend and in the resistance of friction therebetween and hence to inhibit interfacial separation between the resin particle or particle comprising the resin particle and the adherend. When this resin particle is held at 200°C for 10 minutes in the state of being compressed by 30% with respect to the particle diameter and thereafter released from the compression, then the released resin particle satisfies the following. In cases when the distance between one end and the other end, along the compression direction, of the released resin particle is taken as X, then the ratio of the major-axis length of the released resin particle as measured at the position 0.05X from said one end toward said other end to the major-axis length of the released resin particle as measured at the position 0.5X from said one end toward said other end is 0.60-0.95.
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Inventors:
MORITA HIROYUKI (JP)
Application Number:
PCT/JP2020/030186
Publication Date:
February 11, 2021
Filing Date:
August 06, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G59/18; B32B1/00; C08J3/12; C08L25/04; C08L33/00; C09J9/02; C09J201/00; H01B1/00; H01B1/22; H01B5/00; H01B5/16; H01R11/01
Domestic Patent References:
| WO2018230470A1 | 2018-12-20 |
Foreign References:
| JP2017037070A | 2017-02-16 | |||
| JP2003043495A | 2003-02-13 | |||
| JP2019046801A | 2019-03-22 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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