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Patent Searching and Data


Title:
RESIN PARTICLE AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2001/070826
Kind Code:
A1
Abstract:
A resin particle which has a higher function and is suitable for various uses. The particle has two surfaces composed of two curved surfaces or of one curved surface and one plane and has a boundary line between the two surfaces. In a side view thereof wherein the boundary line is a horizontal line, the resin particle satisfies the relationships (I) 0.1 $g(m)m $m(F) D $m(F) 500 $g(m)m and (II) 0.05 $m(F) d / D $m(F) 0.8 wherein D is the particle diameter in the horizontal direction and d is the maximum height in the vertical direction.

Inventors:
SAKUMA ITARU (JP)
Application Number:
PCT/JP2001/002182
Publication Date:
September 27, 2001
Filing Date:
March 19, 2001
Export Citation:
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Assignee:
SEKISUI PLASTICS (JP)
SAKUMA ITARU (JP)
International Classes:
C08F2/18; C08F255/10; C08F283/12; (IPC1-7): C08F2/18
Foreign References:
JP2000038455A2000-02-08
Other References:
See also references of EP 1266908A4
Attorney, Agent or Firm:
Nogawa, Shintaro (1-3 Nishitenma 5-chom, Kita-ku Osaka-shi Osaka, JP)
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