Title:
RESIN PARTICLES FOR MOLDING AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2001/029131
Kind Code:
A1
Abstract:
Resin particles for molding which comprise 35 to 98 wt.% polytetrafluoroethylene particles having an average particle diameter of 120 $g(m)m or smaller, 35 to 2 wt.% particles of a heat-resistant aromatic polyoxybenzoyl ester resin to which water repellency has been imparted, and 30 to 0 wt.% inorganic filler, wherein the resin particles have an apparent density of 0.6 g/cm?3¿ or higher and an average particle diameter of 800 $g(m)m or smaller and give a molded article having an elongation at break of 20% or higher. The resin particles for molding not only are free from filler separation and excellent in properties important for powder handling, such as flowability and apparent density, but give a PTFE molding having an extraordinarily high elongation.
Inventors:
SUKEGAWA MASAMICHI (JP)
ASANO MICHIO (JP)
ASANO MICHIO (JP)
Application Number:
PCT/JP2000/007221
Publication Date:
April 26, 2001
Filing Date:
October 18, 2000
Export Citation:
Assignee:
DAIKIN IND LTD (JP)
SUKEGAWA MASAMICHI (JP)
ASANO MICHIO (JP)
SUKEGAWA MASAMICHI (JP)
ASANO MICHIO (JP)
International Classes:
C08K3/00; C08L27/18; C08L67/03; (IPC1-7): C08L27/18; C08L67/03; C08K3/04
Foreign References:
| US5709944A | 1998-01-20 | |||
| JPH09157472A | 1997-06-17 | |||
| JPH05287151A | 1993-11-02 | |||
| JPH01259055A | 1989-10-16 |
Other References:
See also references of EP 1241223A4
Attorney, Agent or Firm:
Asahina, Sohta (Tanimachi 2-chome Chuo-ku, Osaka-shi Osaka, JP)
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