Title:
RESIN PASTE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/115343
Kind Code:
A1
Abstract:
Provided are: a low cost resin paste composition that is suitably used for adhering conductor elements such as semiconductor chips and the like to a supporting member such as a lead frame or the like, that reduces the usage of silver which is a high cost material with high scarcity value, and that has excellent electrical conductivity, thermal conductivity, and adhesion, as well as excellent coating workability and mechanical properties; and a semiconductor device using the resin paste composition.
Inventors:
INOUE YUKARI (JP)
FUJITA MASARU (JP)
YAMADA KAZUHIKO (JP)
FUJITA MASARU (JP)
YAMADA KAZUHIKO (JP)
Application Number:
PCT/JP2013/058136
Publication Date:
July 31, 2014
Filing Date:
March 21, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J4/02; C09J11/04; C09J11/06; C09J201/00; H01L21/52
Domestic Patent References:
| WO2012124527A1 | 2012-09-20 | |||
| WO2011158753A1 | 2011-12-22 | |||
| WO2012086588A1 | 2012-06-28 |
Foreign References:
| JP2004197030A | 2004-07-15 | |||
| JP2008171828A | 2008-07-24 | |||
| JP2003272442A | 2003-09-26 | |||
| JP2005197118A | 2005-07-21 | |||
| JP2004319454A | 2004-11-11 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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