Title:
RESIN, PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY DEVICE EACH USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/121691
Kind Code:
A1
Abstract:
Provided is a resin which has a low linear thermal expansion coefficient and a low absorbance. This resin is characterized by comprising at least one structure that is selected from among structures represented by general formula (1) or (2).
Inventors:
YUBA TOMOYUKI (JP)
MASUDA YUKI (JP)
JIN JIAKE (CN)
LI PING (CN)
MASUDA YUKI (JP)
JIN JIAKE (CN)
LI PING (CN)
Application Number:
PCT/JP2016/052016
Publication Date:
August 04, 2016
Filing Date:
January 25, 2016
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G73/10; C07C41/22; C07C43/225; C07C209/74; C07C211/52; C07C231/02; C07C231/12; C07C233/43; C07D209/48; C07D263/62; C08L79/08; G03F7/023; H01L21/027; H05K3/28
Foreign References:
| JP2000214585A | 2000-08-04 | |||
| JP2002341169A | 2002-11-27 | |||
| JPH04331230A | 1992-11-19 |
Other References:
MENG-YANG CHANG ET AL.: "Synthesis of polyphenyls", TETRAHEDRON, vol. 69, 2013, pages 228 - 234
HIDETOSHI GOTO ET AL.: "Double helix formation of oligoresorcinols in water :Thermodynamic and kinetic aspects", JOURNAL OR THE AMERICAN CHEMICAL SOCIETY, vol. 131, no. 13, 2009, pages 4710 - 4719
HIDETOSHI GOTO ET AL.: "Double helix formation of oligoresorcinols in water :Thermodynamic and kinetic aspects", JOURNAL OR THE AMERICAN CHEMICAL SOCIETY, vol. 131, no. 13, 2009, pages 4710 - 4719
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