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Title:
RESIN AND PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/084694
Kind Code:
A1
Abstract:
Provided is a resin with which it is possible to produce a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin including, as a main component, a structure represented by general formula (1) or (2), wherein R2 includes an organic group represented by general formula (3) and an organic group represented by general formula (4).

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Inventors:
MASUDA YUKI (JP)
KIUCHI YOHEI (JP)
OKUDA RYOJI (JP)
Application Number:
PCT/JP2015/082523
Publication Date:
June 02, 2016
Filing Date:
November 19, 2015
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G73/10; C08G69/42; G03F7/004; G03F7/023; H01L21/027
Domestic Patent References:
WO2010004849A12010-01-14
Foreign References:
JP2008007744A2008-01-17
JP2007016214A2007-01-25
JP2012068413A2012-04-05
JP2009198957A2009-09-03
JP2000034346A2000-02-02
JP2003005369A2003-01-08
JP2002162743A2002-06-07
Other References:
See also references of EP 3225647A4
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