RESIN PLATE, RESIN PLATE MANUFACTURING METHOD, AND INSULATING MATERIAL UNIT USING RESIN PLATES

Title:

RESIN PLATE, RESIN PLATE MANUFACTURING METHOD, AND INSULATING MATERIAL UNIT USING RESIN PLATES

Document Type and Number:

WIPO Patent Application WO/2017/104344

Kind Code:

A1

Abstract:

[Problem] To improve the connection strength in a folded portion formed by folding a portion of a resin plate. [Solution] This resin plate comprises a resin plate body, a fold formed in the plate body, and a folded portion formed by folding a portion of the plate body along the fold. The fold comprises a high-density portion and a low-density portion, and the high-density portion and the low-density portion are disposed alternately in the direction in which the fold extends. In addition, the high-density portion is formed so that the prescribed unit density is higher than the density in portions outside of the fold, and the low-density portion is formed so that the prescribed unit density is lower than the density in the high-density portion.

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Inventors:

KURANO MASATOSHI (JP)
KII KAZUYUKI (JP)
HIRAKAWA MASAFUMI (JP)

Application Number:

PCT/JP2016/084122

Publication Date:

June 22, 2017

Filing Date:

November 17, 2016

Export Citation:

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Assignee:

NICHIAS CORP (JP)

International Classes:

E04C2/30; B29C53/04; E04B1/78

Foreign References:

EP0892121A1	1999-01-20
JP2015224065A	2015-12-14
JPH0129360Y2	1989-09-06
JP2015027781A	2015-02-12
JP4908564B2	2012-04-04
JP3785112B2	2006-06-14

Attorney, Agent or Firm:

MIZUNO, Katsufumi et al. (JP)

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