Title:
RESIN FOR POSITIVE RESIST COMPOSITION, AND POSITIVE RESIST COMPOSITION USING THE SAME, LAMINATE AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2005/003196
Kind Code:
A1
Abstract:
The use of a positive resist resin comprising a resin having a specific structure has been found to improve the resolution and provide a resist pattern having a good shape and further to make a resist layer less prone to tailing or forming a recess when the resist layer is formed on a magnetic film or on an oxidation-resistant layer made of a metal formed on the magnetic layer.
Inventors:
SHINBORI HIROSHI (JP)
Application Number:
PCT/JP2004/009875
Publication Date:
January 13, 2005
Filing Date:
July 05, 2004
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
SHINBORI HIROSHI (JP)
SHINBORI HIROSHI (JP)
International Classes:
G03F7/039; (IPC1-7): C08F212/14; C08F220/18; G03F7/039
Foreign References:
| JP2002234910A | 2002-08-23 | |||
| JP2001081137A | 2001-03-27 | |||
| JP2001142214A | 2001-05-25 | |||
| JP2003110166A | 2003-04-11 | |||
| JP2003124539A | 2003-04-25 | |||
| JP2003031867A | 2003-01-31 | |||
| JP2002100013A | 2002-04-05 |
Attorney, Agent or Firm:
Tanai, Sumio (Yaesu Chuo-ku, Tokyo, JP)
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